To Drive Worldwide Electronic Smart Packaging Market over the Forecast Period: Ken Research


The packaging of products & goods is essential to protect or prevent them from the external and internal environments. Nowadays, the packaging has become a necessary component primarily due to rising nuclear families & bachelor’s life has led a stipulate for ready to serve food where there is a need for quality food or shelf life. Growing awareness for quality & increasing adoption of technology and shelf life have resulted in the perception of smart packaging that offers improved shelf life, display information on quality, monitors freshness, improves safety, and is more convenient. The electronic packaging is the highly developed type of smart packaging. It is used to send sound, display, light, or electronic signals. This composes the packaging more secure, attractive, and highly interactive. It is also used for cost reduction, brand enhancement & protection, increasing sales, error prevention, user friendliness, removing tedious procedures, automated data collection and reduced crime etc.

Worldwide Electronic Smart Packaging Market

According to study, “Worldwide Electronic Smart Packaging Market – Technologies (RFID, NFC, BLE and EAS), Applications (Printed Sensor, Printed Touch, Printed Light, Printed RFID and Printed Antennas), End-Users (Food, Beverage, Healthcare, Personal Care, Logistics and Machineries), By Regions – Drivers, Opportunities, Trends, and Forecasts, 2016-2022” some of the major companies that are currently working in the worldwide electronic smart packaging market are Thin Film Electronics ASA, Sealed Air, Smartrac N.V., PakSense, Bemis Company Inc., Ametek Inc., 3M Co., NEXX Systems Inc., RR Donnelley & Sons Co., Blue Spark Technologies Inc., PST Sensors, Saralon GmbH, Printechnologics.

Based on technology, worldwide electronic smart packaging market is segmented into NFC, Electronic Article Surveillance (EAS), Radio Frequency Identification (RFID) and Bluetooth Low Energy (BLE). Based on devices, the market is bifurcated into transistor less circuits & materials, silicon chips & conventional electronics, printed thin film transistor circuits (TFTCS), disposable batteries, printed electronic displays & other new human interfaces, sensors, piezoelectric and laminar microphones & loudspeakers. Based on precursors, the market is segmented into barcodes & magnetic stripes, written & printed information, electrical or mechanical & chemical smart packaging, mechanical smart packaging and uncontrolled active packaging. Based on application, market is defined as printed touch, printed light, printed antennas (printed RFID antenna & printed NFC antenna), printed security, printed heater, printed sensors, printed RFID and others. Moreover, based on end-user, market is classified as beverage, logistics or transporting, industry machineries, healthcare, food, personal care and others.

The market of worldwide electronic smart packaging is primarily driven by increase in technology adoption followed by growing consumer demand, reduction of life span of food products, increasing adoption of wireless communications & IoE, lack of organic products, and cloud computing low cost & less weight and increasing ageing population etc. Apart from the major benefits, few hinder factors include increasing competition leading to price war, followed by lack of awareness about electronics in smart packaging. Furthermore, some of the other key opportunities include improving market conditions & falling costs and use of NFC technology.

Europe is set to be the foremost region for electronic smart packaging market followed by Asia Pacific & North America. The increasing spending on IoE technologies, rising knowledge of printed electronic technologies in smart packaging, and rising mobile subscriber base in the developing countries is anticipated to drive growth of the market over the forecast period. It is estimated that the worldwide electronic smart packaging market to accomplish US $1,700.8 million, by 2022.

To know more, click on the link below:-

Worldwide Electronic Smart Packaging Market

Contact Us:-

Ken Research

Ankur Gupta, Head Marketing & Communications



Comments are closed.