According to our research analysis, Europe advanced packaging market 2021-2031 was valued at USD 3,029.1 million in 2021 and will grow by 8.9% annually over 2021-2031 owing to the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging.
Highlighted with 30 tables and 42 figures, this 99-page report Europe Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity is based on a comprehensive research of the entire Europe advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
- Market Structure
- Growth Drivers
- Restraints and Challenges
- Emerging Product Trends & Market Opportunities
- Porter’s Fiver Forces
The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify Europe advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country.
Based on Product Type, the Europe market is segmented into the following sub-markets with annual revenue (USD mn) for 2021-2031 included in each section.
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- Active Packaging
- Smart and Intelligent Packaging
Based on Packaging Platform, the Europe market is segmented into the following sub-markets with annual revenue (USD mn) for 2021-2031 included in each section.
- Flip-Chip Ball Grid Array
- Flip Chip CSP
- Wafer Level CSP
- 5D/3D Integrated Circuit
- Fan Out Wafer Level Package (Fo-WLP)
- Embedded Die
- Fan In Wafer Level Package (Fi-WLP)
- Other Packaging Platforms
By End User, the Europe market is segmented into the following sub-markets with annual revenue (USD mn) for 2021-2031 included in each section.
Consumer Electronics
- IT and Telecom
- Automotive and Transportation
- Industrial Sector
- Healthcare and Life Science
- Aerospace and Defense
- Other End Users
For More Information, refer to below links:
Europe Advanced Packaging Market Major Players
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