Phase Change Thermal Interface Material (PCTIM) is a material which remains solid at room temperature and it starts altering to liquid form, as and when temperature is increased. These are effective alternative to thermal greases, saving time and money without foregoing thermal performance. The use of phase change thermal technology is critical due to heat generation is a mounting concern as more power and speed is packed into smaller devices across applications from mobile smart phones and tablets to CPUs, video graphics array, products, servers, display cards, and telecom products. The advances in phase changing technology have overcome such concerns and made striking and verified thermal management solution in stimulating the varied applications. The PCMs are also playing an essential role for the development of future electronics technologies have been already proven value over a variety of new and demanding applications. The thermal interface materials manage excess heat, reduced temperature operations and ensuring of the long-term reliability. The materials change from a solid at specific phase and temperatures variations and their flow provides a total wet-out of the interface without overflow resulting thermal interface comparable to grease, without the much contamination and hassle.
According to study, “Global Phase Change Thermal Interface Material (PCTIM) Market Status (2015-2019) and Forecast (2020-2024) by Region, Product Type & End-Use” the key companies operating in the global phase change thermal interface material market are 3M Company, Henkel AG & Co. KGaA, Dow Corning Corp., Honeywell International Inc., Parker Chomerics, Enerdyne Thermal Solutions, Shin-Etsu Chemical, Indium, T-Global Technology, Laird Plc., Stockwell Elastomerics, AavidThermalloy, Universal Science, Arctic Silver, Wakefield-Vette, Bergquist Company, AI Technology. Market participants are endlessly investing on new research & development (R&D) techniques, product innovations and expansions to increase the market share.
Based on type, phase change thermal interface material market is segmented into low melting point metal and organic phase change thermal conductivity material. Based on conductive type, market is segmented into electrically conductive and non-electrically conductive. Based on binder type, market is segmented into paraffin, non-paraffin, salt hydrates and eutectic salts. Based on filler type, market is segmented into aluminum oxide, aluminum nitride, boron nitride, zinc oxide, and other filler types. In addition, based on application, market is segmented into computers, telecommunication, electrical & electronics, automotive, and other applications. The computers application dominates the market owing to rapid internet penetration in the developing countries.
The phase change thermal interface material market is driven by growth in consumer electronics industry, followed by rise in demand from the gaming module industry, rapid urbanization, increase in functionality of electronic devices and high cost of surface finishing. However, reduction in the size of mobile handsets and development of non-silicone substitutes may impact the market. Moreover, replacement of thermal greases is a key opportunity for market.
Based on geography, the Asian-Pacific region holds major share in phase change thermal interface material market owing to growth in popularity of Video-on-demand (VoD) and internet in the region. Whereas, the European and Asian-Pacific regions are estimated to witness higher growth rate due to rise in demand for miniaturization of electronic devices over the forecast period.
For More Information, click on the link below:-
Ankur Gupta, Head Marketing & Communications