North America Advanced Packaging Market Forecast 2021-2031

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According to our research analysis, North America advanced packaging market 2021-2031 is projected to grow by 8.1% annually in the forecast period and reach USD 8,293.6 million by 2031, driven by the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging.

Highlighted with 20 tables and 38 figures, this 89-page report North America Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity is based on a comprehensive research of the entire North America advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:

Market Structure
Growth Drivers
Restraints and Challenges
Emerging Product Trends & Market Opportunities
Porter’s Fiver Forces

The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify North America advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country.

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Based on Product Type, the North America market is segmented into the following sub-markets with annual revenue (USD mn) for 2021-2031 included in each section.

Active Packaging
Smart and Intelligent Packaging

Based on Packaging Platform, the North America market is segmented into the following sub-markets with annual revenue (USD mn) for 2021-2031 included in each section.

Flip-Chip Ball Grid Array
Flip Chip CSP
Wafer Level CSP
5D/3D Integrated Circuit
Fan Out Wafer Level Package (Fo-WLP)
Embedded Die
Fan In Wafer Level Package (Fi-WLP)
Other Packaging Platforms

By End User, the North America market is segmented into the following sub-markets with annual revenue (USD mn) for 2021-2031 included in each section.