The report titled “China Advanced Packaging Industry Situation and Prospects Research Report”, provides a comprehensive analysis of advanced packaging industry, leading players, trends in advanced packaging industry, and future of China’s advanced packaging market.
Industry Overview: China has witnessed an increased in economic development over the recent years and increase in converters. China has more than five thousand converters operating at various locations within the country and witnessed an increase in revenue. Majority of the converters are specialized companies which combine materials such as plastic, paper, cellulose, aluminium and convert them into packaging products. Almost all the converters in China supply their products to the domestic food processing industries. Plastic packaging segment is the largest packaging market in China and accounts for a major share in the packaging industry. To meet the increasing needs of the growing population in China, various types of plastic packaging materials are available to pack various products. The end-users of the advanced packaging materials are pharmaceutical, healthcare, food, beverages and other end-user applications. Food and beverages sector is the major consumer of the advanced packing materials in China and this trend will continue growing over the next few years with more availability of package foods. It was observed that there is an increased adoption of advanced packaging to enhance the shelf life of food and beverages. There is a growing demand for carbonated and non-carbonated drinks which demand for advanced packaging technologies for more preservation options.
Leading Players in Advanced Packaging Industry: The advanced packaging techniques provide relevant information about the condition and expiry of product, thus aiding to consumer awareness. Advanced packaging industry is segmented based on active technology, intelligent technology, and modified atmosphere. The leading players in the advanced packaging industry in China are Altera, Amkor, Analog Devices, Ardentec, Atmel, AOI Electronics, Apple, ARM, ASE, Avago, Broadcom, Carsem, China WLCSP, Chipbond, ChipMOS, Cisco, Cypress Semiconductor, Deca Technologies, Greatek, IC Interconnect, Fairchild, Facebook, Flip Chip International, Formosa, Freescale, Fujitsu, Globalfoundries, Google, Hana Micron, Huawei, Inari Berhad, Intel, Intersil, J-Devices, JCET, KingYuan, Linear Technology, LB Semicon, Lingsen Precision, Maxim, MaxLinear, MediaTek, Microchip, Microsemi, Movidius, Nantong-Fujitsu, Nanium, Nepes, Nvidia, NXP, ON Semiconductor, OptoPAC, Orient Semiconductor, Powertech Technology, Renesas, Qualcomm, Rohm, Samsung, SilTech, Sigurd, SK Hynix, Softbank, SPIL, ST Microelectronics, STATS ChipPAC, STS Semiconductor, Teraprobe, Texas Instruments, Tianshui Huatian, Tong Hsing, Toshiba, TSMC, Unisem, UTAC and Walton Advanced Engineering.
Future of Advanced Packaging Industry: Few factors involved in the market are business demand for rapid delivery, wide product ranges, competitive prices and excellent service which motivates the growth in advanced packaging industry in China. Advanced packaging industry in China is expected to grow steadily over the next few years. This trend has encouraged the advanced packaging companies to deploying complex strategies to develop their activities such as R&D and manufacturing capacity in China. Technical innovation is also a priority for all China-based advanced packing companies. Majority of the manufacturers are keen in developing disruptive technologies.
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Ankur Gupta, Head Marketing & Communications